Abbreviations and Acronyms

Here you can find abbreviations and acronyms that are frequency used within this collaborative research center.

If you don't find what you are looking for and you have the impression that this is a relevant abbreviation for the whole team, than please write an e-mail (glossary@crc1261.biomagnetic-sensing.de). Ideally, you try to find a the long version and a goog explanation and send us everything. Otherwise, we try to do this for you.

 

 

           

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Term Definition

CVD (Chemical Vapor Deposition)

Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films.

In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

Microfabrication processes widely use CVD to deposit materials in various forms, including: monocrystalline, polycrystalline, amorphous, and epitaxial. These materials include: silicon (dioxide, carbide, nitride, oxynitride), carbon (fiber, nanofibers, nanotubes, diamond and graphene), fluorocarbons, filaments, tungsten, titanium nitride and various high-κ dielectrics.

The term chemical vapour deposition was coined in 1960 by John M. Blocher, Jr. who intended to differentiate chemical from physical vapour deposition (PVD).

Text from Wikipedia

Contact

Prof. Dr. Gerhard Schmidt

Spokesperson of the CRC 1261

Kiel University
Faculty of Engineering
Institute of Electrical and Information Engineering

gus@tf.uni-kiel.de

 

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